Description

ABB S-073N 3BHB009884R0021

Functional Features

High-Power Semiconductor Module Characteristics

Likely belonging to Thyristor or IGBT modules, suitable for medium and high-voltage power electronics systems, such as frequency converters, motor drives, power transmission, and other scenarios.
Adopts advanced semiconductor chip technology, supporting high voltage (thousands of volts) and large current (hundreds of amperes) conditions. Specific parameters should be referenced in the technical manual.

Efficient Heat Dissipation Design

Integrates a ceramic substrate or metal radiator, supporting forced air cooling or water cooling to ensure heat dissipation efficiency during high-power operation and prevent chip overheating damage.
Optimized heat dissipation structure, suitable for industrial environments requiring long-term continuous operation.

High Reliability and Durability

Passes strict electrical/mechanical tests (such as vibration and impact resistance), adapting to harsh industrial environments (e.g., high temperature, dust, electromagnetic interference).
Designed for long service life, reducing maintenance frequency, and suitable for scenarios with high reliability requirements (e.g., power grids, large industrial equipment).

Modularity and Flexibility

Standardized packaging (such as press-fit or welded types) facilitates quick installation, replacement, and system integration.
Supports parallel or series operation, flexibly expanding the system's power rating (e.g., increasing voltage/current capacity through multi-module combinations).

Protection and Control Functions

May include built-in overvoltage and overcurrent protection mechanisms (or require coordination with external circuits), supporting rapid fault shutdown to ensure system safety.
Compatible with multiple drive circuits, enabling precise control of conduction characteristics via trigger pulses (e.g., thyristor trigger delay angle).

Technical Parameters

Parameter	Typical Value	Description
Rated Voltage (VDRM/VRRM)	May ≥3000 V	Peak Repetitive Off-State Voltage / Peak Repetitive Reverse Voltage
Rated Current (IT(AV))	May ≥200 A	Average On-State Current
Surge Current (ITSM)	Thousands of amperes	Non-repetitive Peak Surge Current (e.g., 8.3 ms pulse)
On-State Voltage Drop (VTM)	≤1.5 V (typical)	Peak On-State Voltage
Junction Temperature Range (Tj)	-40°C ~ +125°C	Operating Junction Temperature Range
Packaging Type	Press-Fit Ceramic Package	High reliability and heat dissipation
Cooling Method	Forced Air Cooling / Water Cooling	Requires external cooling system
Dimensions and Weight	Approximately 100×80×50mm	Specific dimensions subject to physical product

Application Scenarios

Power Systems

High-Voltage Direct Current (HVDC) transmission converter stations, Flexible Alternating Current Transmission Systems (FACTS) devices, and reactive power compensation (SVC/SVG).

Industrial Drives

Frequency converters for large motors (e.g., rolling mills, hoists, fan drives), soft starters, and DC motor control.

Renewable Energy

Power electronics conversion links in photovoltaic inverters, battery energy storage systems (BESS), and wind power converters.

Special Power Supplies

High-frequency heating power supplies, welding power supplies, pulse power supplies, and rail transit traction systems.

Operation and Maintenance Recommendations

Installation Notes

Electrical Connections: Ensure secure wiring and correct polarity, minimizing parasitic inductance in high-current loops.
Heat Dissipation Installation: Apply thermal grease between the module and radiator. Ensure adequate air volume in air-cooling systems and prevent water leakage in water-cooling systems.
Insulation Protection: Use appropriate insulating materials and maintain safe spacing in high-voltage environments.

Parameter Configuration

Set trigger pulse parameters (e.g., delay angle, pulse width) through supporting drive circuits to ensure reliable conduction.
Connect to control systems (e.g., PLC, DSP) to achieve real-time monitoring and protection logic (e.g., overcurrent tripping).

Maintenance and Fault Diagnosis

Regularly inspect the appearance for cracks, burns, or overheating marks.
Measure pin resistance after power-off and compare with normal parameters to assess chip status.
When faults occur, troubleshoot external circuits (e.g., load short circuits, abnormal drive signals) and replace the module if necessary.