Abaco Systems VME-7807RC-410000 350-930078074-410000 G | Single Board Computer

Abaco Systems VME-7807RC-410000 350-930078074-410000 G | Single Board Computer

Brand: Abaco Systems / VMIC

Product ID: VME-7807RC-410000 350-930078074-410000 G

Condition: New / used

Terms of payment: Paypal、T/T 、Western Union

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Description

Abaco Systems VME-7807RC-410000

I. Overview


Abaco Systems VME-7807RC-410000 350-930078074-410000 G (hereinafter referred to as VME-7807RC) is a VME bus embedded computing module positioned as the "core unit for high-reliability real-time data processing in harsh environments". It is widely used in fields with extremely high requirements for equipment stability, real-time performance, and resistance to harsh environments, such as aerospace, defense electronics, industrial automation, and energy exploration. As a core computing node in the VME bus architecture, this module undertakes core tasks including real-time data acquisition, complex algorithm operation, multi-device collaborative control, and key task scheduling, providing strong hardware computing support for critical scenarios such as radar signal processing, UAV flight control systems, and industrial process closed-loop control.


The VME-7807RC is highly compliant with the VMEbus Rev. C.1 bus specification. It adopts a high-performance multi-core processor architecture, an enhanced heat dissipation design, and a multi-layer anti-interference protection mechanism. It can be directly connected to a standard VME rack, enabling seamless collaboration with various VME bus I/O modules and storage modules without the need for additional adapter modules. Its core advantages lie in strong multi-core parallel processing capabilities, fast real-time response speed, excellent environmental adaptability, and outstanding bus compatibility. It can be adapted to various application scenarios ranging from small and medium-sized embedded systems to large-scale distributed real-time computing platforms. It can operate stably for a long time under working conditions such as a wide temperature range of -40℃ to 85℃, strong vibration, high impact, and strong electromagnetic interference, meeting the strict requirements for equipment reliability and performance in military-grade (such as GJB) and high-end industrial-grade applications (such as MIL-STD).



II. Technical Parameters


Parameter CategorySpecification ParametersDetailed Description
Processor & Memory ParametersCore ProcessorIntel Core i7-6820EQ quad-core eight-thread processor, with a main frequency of 2.8GHz, a maximum turbo frequency of 3.5GHz, and 8MB cache. It adopts a 14nm process, and supports Intel vPro technology and hyper-threading technology.

Memory Configuration16GB DDR4-2133 ECC SDRAM, supporting error checking and correction functions, with a memory bandwidth of 25.6GB/s and expandable to 32GB; on-board 8GB eMMC high-speed flash memory (16GB/32GB optional).

Storage Interface1 SATA III 6.0Gbps interface (supporting 2.5-inch SSD/HDD), 1 PCIe 3.0 x4 interface (expandable to NVMe high-speed solid-state drive), and supporting RAID 0/1 (RAID controller optional).

Expansion Capability1 PCIe 3.0 x16 interface (bridged via VME bus), 2 PCIe 3.0 x4 interfaces, supporting various Abaco dedicated expansion cards (such as multi-serial port cards, acquisition cards).
Bus & Communication ParametersBus SpecificationCompliant with VMEbus Rev. C.1 specification, supporting VME64x expansion standard; maximum bus data transmission rate of 160MB/s (block transfer mode), and supporting 32-bit/64-bit address space.

Communication Interface2 10/100/1000BASE-T Gigabit Ethernet interfaces (RJ45, supporting IEEE 1588 PTP precise clock synchronization), 4 RS-232/422/485 serial ports (DB9 interface, supporting hardware flow control), 2 USB 3.0 interfaces, and 1 VGA display interface.

Real-Time CommunicationSupports aerospace bus interfaces such as ARINC 429 and MIL-STD-1553B (realized via expansion card); integrated with a dedicated real-time clock (RTC) with a timing accuracy of ±1ppm, supporting power-off battery backup (powered by a button battery).

Bus ArbitrationSupports two modes of VME bus priority arbitration and fair arbitration; configurable as a bus master or slave device; with bus error detection and recovery functions.
Power Supply & Power Consumption ParametersPower Supply SpecificationDual-channel redundant power supply: +5V DC (±5%), +12V DC (±10%); maximum current of +5V is 15A, maximum current of +12V is 8A; with overvoltage, overcurrent, undervoltage, and reverse connection protection functions.

Power Consumption IndicatorTypical power consumption: ≤65W (full-load operation, excluding expansion cards); standby power consumption: ≤10W; maximum power consumption: ≤90W (full load + full load of PCIe expansion cards); intelligent power management, supporting dynamic processor frequency reduction for energy saving.

Heat Dissipation DesignAll-aluminum heat dissipation fins + embedded heat pipe heat dissipation structure, supporting both natural heat dissipation and forced air cooling modes; automatically activating fan speed adjustment (fan speed adjustable from 0 to 5000RPM) in high-temperature environments.
Environmental & Physical ParametersEnvironmental AdaptabilityOperating temperature: -40℃ to 85℃; storage temperature: -55℃ to 125℃; relative humidity: 5%-95% (no condensation, compliant with MIL-STD-810G standard); vibration resistance: 10-2000Hz, 3g (three axes, compliant with MIL-STD-810G Method 514.6); shock resistance: 50g (peak, 11ms, half-sine wave, compliant with MIL-STD-810G Method 516.6).

Physical SpecificationsDimensions: 367mm×160mm×40mm (L×W×H); installation method: standard 6U VME rack embedded installation; weight: approximately 2.8kg; housing material: aluminum alloy (anodized, anti-static and anti-corrosion); protection class: IP40 (module body).
Reliability & Software ParametersReliability IndicatorsMean Time Between Failures (MTBF): ≥500,000 hours; service life: ≥10 years; supporting hot swapping (needing to be used with VME rack hot-swap backplane); with module-level health status monitoring function.

Software CompatibilitySupports real-time operating systems such as Windows 10 IoT Enterprise, Linux (Ubuntu 18.04/20.04, Red Hat Enterprise Linux 7/8), and VxWorks 7; provides Abaco Device Driver Package, supporting development tools such as LabVIEW and MATLAB.


III. Functional Features


1. High-Performance Multi-Core Architecture with Excellent Real-Time Data Processing Capability

Equipped with the Intel Core i7-6820EQ quad-core eight-thread processor (main frequency 2.8GHz, maximum turbo frequency 3.5GHz) and combined with 8MB high-speed cache, it enables efficient parallel processing of multiple tasks. The processor scheduling mechanism optimized for real-time computing scenarios can effectively reduce task switching latency, with a core task response time of ≤10μs. The 16GB DDR4 ECC memory supports error checking and correction functions, which can automatically repair single-bit errors and detect double-bit errors to avoid system crashes caused by memory errors. With a memory bandwidth of 25.6GB/s, it ensures high-speed transmission and caching of large-scale data (such as radar echo data and industrial sensor array data). The combination of on-board eMMC flash memory and SATA/NVMe storage interfaces can meet storage needs in different scenarios; after expanding the NVMe interface, the storage read-write speed can reach 2GB/s, providing support for local caching of massive real-time data.


2. Deep Compatibility with Standard VME Bus for Seamless and Efficient System Integration

It strictly complies with the VMEbus Rev. C.1 specification and VME64x expansion standard, and can be directly embedded into a standard 6U VME rack. Mechanical fixation and electrical connection are realized via VME bus connectors, and no additional adapter components are required during installation, enabling physical installation and bus connection within 15 minutes. When used as a VME bus master device, it supports 32-bit/64-bit address space access, with a maximum bus data transmission rate of 160MB/s in block transfer mode, allowing efficient scheduling of peripheral devices such as I/O modules and acquisition modules on the bus. When used as a slave device, it can quickly respond to instructions from the main controller, with a data reception latency of ≤500ns. It is compatible with mainstream VME bus arbitration mechanisms, supporting priority arbitration (to ensure priority transmission of key task data) and fair arbitration (to prevent a single device from monopolizing the bus). It also has bus error detection, fault isolation, and automatic recovery functions; when an abnormality occurs on the bus, it can switch to the backup communication path within 1ms to ensure the continuity of system communication.


3. Rich Expansion Interfaces for Adapting to Diverse Application Scenarios

It integrates diverse expansion interfaces to meet the customized needs of different industry applications: 2 Gigabit Ethernet interfaces support IEEE 1588 PTP precise clock synchronization, with a clock synchronization accuracy of ±10ns, enabling time coordination of multiple nodes in a distributed system; 4 multi-protocol serial ports support RS-232/422/485 mode switching, adapting to low-speed peripheral devices such as industrial sensors and serial port devices; via the PCIe 3.0 interface, it can be expanded with Abaco dedicated aerospace bus cards (such as ARINC 429 and MIL-STD-1553B) to directly access the bus network in the aerospace field without the need for additional protocol conversion modules. 1 PCIe 3.0 x16 interface supports the expansion of high-performance graphics cards or data acquisition cards, enabling complex functions such as real-time image processing and high-speed signal acquisition. The interface layout adopts a modular design, and each group of interfaces is equipped with independent signal isolation and protection circuits to improve the working stability of the interfaces.


4. Military-Grade Environmental Adaptability for Stable Operation in Harsh Working Conditions

It is designed for environmental adaptability in accordance with the MIL-STD-810G military standard. Core components are all industrial-grade wide-temperature products, with an operating temperature range covering -40℃ to 85℃, allowing normal operation in extreme environments such as high-temperature deserts, low-temperature plateaus, and humid and hot oceans. The combined heat dissipation structure of all-aluminum heat dissipation fins and embedded heat pipes greatly improves heat dissipation efficiency; when operating at full load in a high-temperature environment of 85℃, the processor temperature can be controlled within 95℃. Combined with the intelligent fan speed control system, the fan stops running to save energy in low-temperature environments and automatically increases speed to enhance heat dissipation in high-temperature environments, balancing heat dissipation performance and low-noise requirements. The vibration and shock resistance design is realized through structural optimization: components inside the module adopt a reinforced welding process, and the bus connectors use a locking design, which can resist 3g continuous vibration and 50g peak shock, meeting the installation requirements of mobile platforms such as vehicle-mounted, ship-mounted, and airborne systems.


5. Multiple Redundancy and Protection for Maximizing Operational Reliability

It adopts a dual-channel redundant power supply design, with the +5V and +12V power supply circuits independently isolated. When one power supply fails, the other can automatically switch to supply power within 2ms to ensure uninterrupted operation of the module. The power supply circuit integrates four layers of protection: overvoltage, overcurrent, undervoltage, and reverse connection. When the input voltage is abnormal or the polarity is reversed, it immediately cuts off the power supply circuit and triggers an alarm to avoid damage to the internal circuits of the module. It supports the VME bus hot-swapping function (needing to be used with a dedicated backplane), enabling replacement and maintenance of the module without shutting down the system, thereby reducing system downtime. The module-level health status monitoring function can collect key parameters in real time, such as processor temperature, memory usage, power supply voltage, and fan speed. When the parameters exceed the threshold, it outputs an alarm signal via the bus and records fault logs, facilitating engineers to predict faults in advance and carry out maintenance.


6. Multi-System Compatibility and Comprehensive Development Support for Rapid Deployment

It is compatible with mainstream operating systems such as Windows, Linux, and VxWorks. The adaptation and optimization for the VxWorks 7 real-time operating system reduce the system scheduling latency to ≤1ms, meeting the needs of high-real-time applications (such as industrial closed-loop control and UAV flight control). Abaco provides a complete Device Driver Package, covering drivers for all interfaces and peripheral devices, supporting plug-and-play and greatly shortening the development cycle. To meet the needs of scientific research and engineering development, it provides interface libraries for development tools such as LabVIEW and MATLAB, allowing engineers to quickly realize data acquisition, algorithm verification, and system control through graphical programming. In addition, Abaco also provides customized software development services, which can optimize system configurations and drivers according to the specific needs of users to ensure seamless integration of the module with the user's existing system.



IV. Common Faults and Solutions


Fault PhenomenonPossible CausesSolutionsPrecautions
Module fails to start, power indicator is off1. Loose or broken wiring of dual-channel power supply (+5V/+12V); 2. Abnormal output voltage of the power supply; 3. Poor contact or incomplete insertion of the bus connector; 4. Damaged internal power circuit of the module; 5. Over-temperature protection triggered by a stuck cooling fan1. Power off, check the +5V and +12V terminal blocks, re-tighten and replace aged wires; 2. Measure the power output with a multimeter to ensure +5V±5% and +12V±10%, replace with a compliant redundant power supply if abnormal; 3. Re-plug the module to ensure the bus connector is fully engaged and locked; 4. Check if the cooling fan is stuck, clean up foreign objects, and manually rotate the fan to confirm smooth operation; 5. If the above measures are ineffective, contact Abaco after-sales service to inspect the internal circuit of the moduleDisconnect the module power supply before measuring the power supply to avoid short circuits; cut off the main power supply before wiring to prevent electric shock; use compressed air to clean the fan and avoid contact with liquids; select a redundant power supply of the same specification when replacing the power supply
Abnormal VME bus communication, unable to recognize peripheral devices1. Bus address setting conflict; 2. Oxidized, bent, or damaged pins of the bus connector; 3. Incorrect configuration of bus arbitration mode; 4. Faulty or incorrectly installed peripheral module; 5. Damaged bus interface circuit of the module1. Verify the addresses of the module and other devices on the bus to ensure unique addresses; 2. Power off, clean the bus pins with a dedicated cleaner, check for bent pins and repair them; 3. Reconfigure the bus arbitration mode (priority/fair arbitration) via configuration software; 4. Replace the peripheral module to a normal slot and confirm if the peripheral device is normal; 5. If the above measures are ineffective, contact after-sales service to inspect the bus interface circuitModify the address only when the power is off, and restart the system after modification; avoid using metal tools to clean the pins to prevent scratches; the arbitration mode configuration should match the overall system design; record the original configuration parameters when replacing peripheral devices
Excessively high processor temperature, triggering frequency reduction or shutdown1. Excessive dust accumulation on heat dissipation fins, reducing heat dissipation efficiency; 2. Faulty cooling fan or insufficient rotation speed; 3. Ambient temperature exceeding the rated range; 4. Long-term 100% processor load leading to insufficient heat dissipation; 5. Aging and failure of thermal grease, resulting in poor heat conduction1. Power off, clean the dust on the heat dissipation fins with compressed air, and disassemble the heat sink for thorough cleaning if necessary; 2. Check the fan rotation speed, replace with a fan of the same specification if abnormal; 3. Improve the ventilation conditions of the installation environment to ensure the ambient temperature ≤85℃; 4. Optimize the software program to reduce redundant processor load; 5. Disassemble the heat sink and replace with new thermal grease (coating thickness: 0.5-1mm)Power off before cleaning the heat sink to avoid damaging the module; select original Abaco fans when replacing to ensure compatibility; use professional temperature measuring equipment to monitor the ambient temperature; apply thermal grease evenly to avoid air bubbles
Memory error alarm, frequent system crashes1. Poor contact of the memory module; 2. Faulty memory module; 3. Dust accumulation or damaged pins in the memory slot; 4. Faulty motherboard memory controller; 5. Memory overflow caused by software compatibility issues1. Power off, remove the memory module, clean the gold fingers, and reinstall; 2. Replace with a spare memory module and test if the error still occurs; 3. Clean the dust in the memory slot with a brush and check for damaged pins; 4. Detect memory stability via memory diagnostic tools (such as MemTest86); 5. Upgrade the operating system or drivers to troubleshoot software memory overflow issuesPower off before inserting or removing the memory module, and wear an anti-static wristband during operation; select ECC DDR4 memory of the same specification; close other programs when running the diagnostic tool; back up important data before software upgrade

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