LAM 715-042721-810 Symmetrical high-flow liner

Description

1. Overview

LAM 715-042721-810 is an OEM Symmetrical High Flow Liner for Lam Research 2300 Series equipment. As a core consumable component of etch chambers, it is specially designed for semiconductor wafer etch process chambers.

Acting as a critical protection and airflow regulating component within the reaction chamber, this liner isolates the plasma reaction environment, organizes the internal airflow field of the chamber, and shields the chamber wall from plasma bombardment, chemical corrosion and process deposition contamination. Meanwhile, it ensures uniform airflow and stable process conditions inside the chamber. It serves as an essential hardware component to sustain consistent wafer etch performance and stable production yield.

Featuring a symmetrical structural design optimized for high-flow gas delivery, this component precisely matches the chamber operating conditions of LAM 2300 Series plasma etchers and suits high-frequency, high-precision and high-cleanliness semiconductor wafer processing. It delivers outstanding resistance to plasma erosion and severe chemical corrosion, uniform airflow guidance, excellent vacuum tightness and sustained low outgassing performance. It effectively mitigates process defects including disordered chamber airflow, local etch deviation, chamber contamination and excessive particle generation.

It is widely adopted for equipment maintenance on semiconductor wafer fabrication lines, replacement of aged chamber liners, chamber process optimization and spare parts inventory, ensuring long-term stable mass production of etch equipment.

2. Technical Features

1. Symmetrical Structure for Uniform Full-Chamber Airflow

Adopting OEM standard integrated symmetrical construction, it strictly conforms to the internal layout of 2300 Series chambers. It accurately regulates inlet and exhaust airflow paths and eliminates local eddies and dead zones inside the chamber.

The high-flow guiding structure meets the equipment’s demand for large process gas throughput and guarantees homogeneous airflow distribution across the entire wafer surface. It fundamentally avoids etch rate deviation, poor pattern uniformity and local wafer process anomalies induced by uneven airflow, greatly improving wafer-to-wafer process consistency.

2. Excellent Resistance to Plasma Bombardment and Corrosion

Manufactured from high-purity corrosion-resistant material dedicated to semiconductor applications with precision forming and surface passivation treatment, the liner withstands long-term high-speed plasma bombardment, energetic particle impingement and erosion by aggressive process gases during etch processes.

Compared with generic liners, it achieves significantly enhanced wear and corrosion resistance, effectively reducing particle generation, substrate peeling and impurity release. It fully satisfies stringent high-cleanliness requirements of semiconductor manufacturing and lowers the defect rate caused by wafer contamination.

3. High-Flow Design for Efficient Mass Production Processes

The proprietary high-flow passage design optimizes channel bore size and flow guiding angles, providing large throughput with low flow resistance. It perfectly satisfies gas supply and evacuation requirements for high-frequency, high-speed mass-production etch processes on 2300 Series tools.

While enabling rapid gas transport, it maintains stable chamber pressure without pressure fluctuation or airflow lag, fitting continuous high-throughput semiconductor wafer production.

4. High Cleanliness & Low Outgassing to Meet Advanced Process Standards

Fabricated with ultra-high-purity raw materials under dust-free precision machining. Finished products undergo rigorous cleaning, dedusting and degassing treatment, featuring ultra-low outgassing, minimal impurity release and zero residual dust.

It effectively prevents wafer surface defects, pinholes and contamination triggered by material outgassing or particle shedding from the liner, fully complying with high-cleanliness and high-precision requirements of advanced semiconductor processes.

5. Precise OEM Form Factor with Great Installation Compatibility

Manufactured in strict accordance with Lam Research original dimensional tolerances and assembly specifications. Geometry, mounting holes, transition radii and sealing interfaces fully match chambers of 2300 Series etchers. No secondary grinding, hole modification or fitting adjustment is required, enabling non-destructive quick disassembly and replacement.

After installation, tight contact and reliable sealing are achieved without chamber leakage, clearance offset or misalignment, fully compatible with native equipment process parameters and operation logic.

6. Long Service Life to Reduce Equipment Maintenance Costs

The material features dense structure and stable mechanical properties with excellent anti-aging, thermal shock resistance and temperature cycling tolerance. It withstands alternating high/low temperature and variable plasma conditions inside the chamber without deformation, cracking or performance degradation over prolonged operation.

Its service life far exceeds generic alternative components. It effectively cuts equipment downtime and part replacement frequency, improves tool utilization and satisfies non-stop mass production requirements of fabrication lines.

3. Technical Specifications

1. Basic Parameters

Model: 715-042721-810

Brand: LAM RESEARCH

Compatible Equipment: LAM 2300 Series Plasma Etchers

Component Type: Chamber Symmetrical High Flow Liner

Core Functions: Chamber airflow conditioning, plasma protection, anti-corrosion isolation for chamber inner wall, cleanliness maintenance, balanced process airflow regulation

OEM Description: LINER, SYMMETRICAL, HIGH FLOW, 2300 SERIES

Application Scenarios: Semiconductor wafer etch processes, chamber maintenance for mass production tools, aged component replacement, process stability optimization

2. Structural & Process Parameters

Structure Form: Integrated symmetrical annular liner

Airflow Performance: High flow capacity, low-resistance guidance, uniform airflow across full area

Manufacturing Process: OEM precision molding, surface passivation, dust-free precision cleaning

Assembly Characteristics: Standard hole alignment, precise chamber fitting, gap-free sealing

Dimensional Tolerance: Compliant with Lam Research micron-level original tolerance standards, matching native chamber structure

3. Material Performance Parameters

Substrate Properties: Ultra-high-purity special corrosion-resistant material, dense non-porous structure

Operating Resistance: Plasma bombardment resistance, resistance to fluorine/chlorine-based corrosive process gases, thermal shock resistance

Cleanliness Grade: Semiconductor high-cleanliness grade, low outgassing, no particle emission, free of organic residues

Wear Resistance: No peeling or powder generation under long-term plasma exposure

Stability: Free of deformation, cracking and performance attenuation under temperature cycling

4. Equipment Compatibility Parameters

Applicable Models: LAM 2300 Series Plasma Etchers

Process Compatibility: Various mass-production dry etch and plasma treatment processes

Function Matching: Compatible with native airflow control, pressure regulation and vacuum chamber operation logic of the equipment

Replacement Property: Direct OEM replacement part; fully interchangeable with aged liners of the same part number without process parameter resetting

5. Environmental & Operating Conditions

Operating Environment: Vacuum plasma chamber environment for semiconductor processes

Temperature Adaptability: Suitable for wide temperature cycling inside process chambers

Ambient Resistance: Vacuum, plasma and corrosive process gas environment

Storage Condition: Normal temperature, dry and dust-free environment; avoid acid/alkali corrosion and mechanical impact

Service Life: Suitable for long-term continuous operation of mass production equipment with sustained stable performance

4. Operating Principle

The LAM 715-042721-810 Symmetrical High Flow Liner operates based on three core mechanisms: structural flow guidance & protection, chamber environment purification and stabilized process conditions.

During equipment operation, the liner is installed inside the etch chamber as a standardized protective barrier. It blocks direct bombardment and corrosion of metal chamber walls by plasma, energetic particles and corrosive process gases, preventing oxidation, peeling and contamination of chamber base material and preserving internal chamber cleanliness at the source.

Meanwhile, the symmetrical high-flow guiding structure accurately distributes process inlet and exhaust gas, homogenizes the internal airflow field and eliminates local dead zones and turbulence. It ensures consistent gas concentration, pressure and flow velocity across the entire wafer processing zone, providing a stable and uniform environment for plasma etch processes.

The liner continuously bears wear and contamination during long-term equipment operation. Periodic replacement of the liner restores the chamber to its original process state without major overhaul of the chamber body. It reliably stabilizes etch rate, uniformity and yield, maintaining consistent mass-production process performance.

5. Application Scenarios

1. Standard Maintenance Replacement for LAM 2300 Series Etchers

As an OEM standard core consumable for LAM 2300 Series plasma etchers, it is widely used for routine maintenance and aged component replacement on production lines.

It can directly replace worn, corroded, contaminated or airflow-degraded old liners, rapidly recovering chamber process performance and resolving issues including non-uniform etching, excessive particles and process drift caused by liner aging to sustain stable mass production.

2. Precision Process Control for Semiconductor Wafer Etching

Suitable for precision dry etch processes of 8-inch and 12-inch semiconductor wafers. Leveraging uniform airflow regulation and high cleanliness, it meets strict requirements for process stability and wafer yield in advanced nodes. It effectively lowers risks of process deviation, surface contamination and pattern defects, supporting high-precision and highly consistent wafer fabrication.

3. Chamber Process Optimization & Yield Improvement

For legacy tools suffering from process drift, airflow disorder and yield fluctuation, installation of a brand-new OEM symmetrical high-flow liner reorganizes the chamber airflow field and optimizes operating conditions. It precisely corrects etch deviations and stabilizes process parameters without hardware modification or recipe revision, enabling low-cost process performance upgrade and mass-production yield enhancement.

4. Spare Parts Support for New Fabrication Lines

Matching complete sets of 2300 Series etchers for newly built semiconductor wafer fabs. As an essential core consumable spare part, it satisfies inventory demands for new tool commissioning, trial production and formal mass production. It ensures stable process startup and sound maintenance infrastructure, accelerating production line ramp-up to target throughput.