Description
I. Basic Information
Part Number：0010-11491
Manufacturer：AMAT (Applied Materials, USA)
Product Type：Semiconductor Vacuum Chamber O-Ring Seal Assembly
Compatible Equipment：AMAT P5000, Centura, Endura Etcher, PVD/CVD Deposition & Ion Implanter Systems
Application Position：Chamber Lid, Gate Valve, Flange Joint, Base Seal, Transfer Chamber Interface
Product Overview：This is a core high-purity sealing consumable for semiconductor wafer processing equipment. Made of special fluororubber material with excellent plasma resistance and chemical corrosion resistance, it is designed for high-vacuum, high-cleanliness and high-energy process environments. It ensures stable chamber vacuum, prevents process gas leakage and external impurity infiltration, and guarantees wafer yield and process stability, widely used in equipment preventive maintenance and leakage failure repair.
Material & Structural Features
Adopting semiconductor-grade high-purity FKM/Viton material and original precision compression molding process, the product features ultra-low volatilization, no particle shedding and no organic precipitation. It maintains stable elasticity and compression recovery under long-term high temperature, high vacuum and plasma bombardment conditions, avoiding permanent deformation, aging cracking and swelling failure. The precise dimension tolerance is fully compatible with original AMAT equipment groove size, supporting direct replacement without secondary processing.
Physical Specifications
- Material：Semiconductor Grade High-purity FKM/Viton
- Hardness：75±5 Shore A
- Vacuum Resistance：10⁻⁶~10⁻⁹ Torr High Vacuum Environment
- Operating Temperature：-20℃ ~ +220℃ (Max 260℃ Instant Temperature)
- Media Resistance：Plasma, Fluorine/Chlorine Corrosive Gas, Organic Solvent, Acid-base Volatile
- Cleanliness Grade：Class 10/100 Ultra-clean Semiconductor Grade
- Service Cycle：6~12 Months (Standard Process Condition)
- Surface Feature：Smooth Mirror Surface, Non-dusting, Non-precipitation
Core Advantages
1. Ultra-clean & Non-precipitation
Low volatile formula without particle shedding, effectively preventing wafer surface contamination and process defects, meeting ultra-high cleanliness requirements of precision semiconductor manufacturing.
2. Excellent Process Corrosion Resistance
Resists long-term plasma bombardment and corrosive process gas erosion, avoiding hardening, cracking and pulverization failure of ordinary rubber seals, improving equipment operational stability.
3. Stable Elastic Sealing Performance
Low permanent compression deformation rate, maintaining stable fitting tightness in long-term vacuum and high-temperature alternating environment, ensuring consistent chamber vacuum and avoiding process parameter drift.
4. 100% Original Compatibility
Fully consistent with original AMAT size and tolerance standards, supporting direct plug-and-play replacement, suitable for equipment maintenance and spare parts reserve.
5. Wide Temperature Adaptability
Excellent thermal stability against temperature shock of equipment start-stop, adapting to 24/7 continuous mass production working conditions.
II. Working Principle
Installed in the sealing grooves of process chambers and flanges, the O-ring produces elastic compression deformation under uniform fastening pressure, filling tiny assembly gaps to form a fully closed sealing barrier. During equipment vacuumizing and wafer processing, it blocks external air, moisture and impurities from entering the chamber and prevents internal process gas leakage. Relying on high corrosion resistance and elastic stability, it maintains complete sealing performance under harsh process conditions, stabilizes vacuum environment and ensures consistent wafer processing quality.
III. Application Scenarios
1. Preventive maintenance seal replacement for AMAT Centura/Endura/P5000 etching & deposition equipment.
2. Vacuum leakage troubleshooting and repair for semiconductor PVD/CVD thin-film process equipment.
3. Ultra-clean sealing application for wafer fabrication vacuum process equipment.
4. Batch spare parts replacement for semiconductor factory regular equipment maintenance.
5. Localization spare parts substitution and technical renovation of imported semiconductor equipment.
