I. Basic Information
Model：AX7670-19
Brand：AMAT (Core Precision Component for Semiconductor Process Equipment)
Product Positioning
The AMAT AX7670-19 is a high-precision vacuum pressure closed-loop controller dedicated to semiconductor manufacturing processes. Designed for wafer etching, thin film deposition, PVD/CVD and ion implantation precision processes, it serves as the core unit for accurate vacuum pressure regulation of process gas circuits. It collects real-time chamber vacuum pressure data and adjusts gas flow and pressure parameters through high-speed closed-loop control to stabilize chamber vacuum degree, effectively avoiding wafer process defects caused by pressure fluctuation. As a standard core control module of AMAT full-series semiconductor process equipment, it is widely applied in 8-inch and 12-inch high-precision wafer manufacturing lines.
Hardware Architecture
Adopting AMAT exclusive integrated precision measurement and control architecture, the device is equipped with a high-precision vacuum pressure sampling unit, high-speed PID processing chip, digital closed-loop regulation circuit, gas circuit drive control unit and multi-stage signal isolation protection circuit. It integrates full functions including pressure sampling, logic operation, parameter adjustment, signal interaction and self-diagnosis. The fully isolated, anti-RFI and dust-sealed board design effectively resists high-frequency electromagnetic interference, temperature and humidity fluctuation and trace process gas corrosion in semiconductor clean workshops. The modular and compact structure features stable heat dissipation, excellent long-term operation stability and aging resistance, meeting the requirements of long-term uninterrupted precision semiconductor manufacturing.
Mounting Specification
Adopting standard embedded cabinet board installation, it perfectly matches the card slot positions of original AMAT process equipment control cabinets with accurate positioning, firm fixation and convenient disassembly. The standardized interface definition fully complies with original equipment specifications for signal terminals, gas ports and power interfaces, supporting universal replacement of new and old equipment. It can be directly used for old module replacement, equipment maintenance and process precision upgrading without equipment modification, enabling rapid system docking and commissioning after installation.
Compatible Systems
Fully compatible with AMAT full-series semiconductor vacuum process equipment, wafer etching machines and thin film deposition systems. It adapts to semiconductor equipment upper computer control systems, process parameter monitoring platforms and PLC industrial control systems, supporting closed-loop process pressure adjustment, real-time data upload, process parameter traceability and equipment linkage protection. It seamlessly integrates into the intelligent management system of semiconductor automated production lines to meet precise process control requirements.
Product Characteristics
Featuring ultra-high vacuum pressure measurement and control accuracy and ultra-fast closed-loop response, it captures and corrects tiny pressure fluctuations in real time to maintain constant chamber vacuum and significantly improve wafer process yield. The optimized self-adaptive PID algorithm ensures no overshoot, no oscillation and extremely low steady-state error, adapting to dynamic working conditions of precision vacuum processes. Built-in comprehensive self-diagnosis and over-limit protection functions detect hidden faults such as pressure abnormality, gas circuit failure, signal anomaly and power fluctuation in real time to ensure process stability and safety. The industrial-grade reinforced precision design features strong anti-interference and anti-aging performance with zero parameter drift, supporting 7×24-hour uninterrupted precision operation in clean rooms.
II. Technical Specifications
1. Core Measurement & Control Parameters
Measurement & Control Range: Covers medium and high vacuum intervals for semiconductor processes, fully adapting to vacuum working conditions of wafer etching and thin film deposition with micro-pressure level precise regulation capability. Control Accuracy: Ultra-high steady-state control accuracy with extremely low full-range steady-state error, fully meeting nano-level precision semiconductor process standards. Response Performance: Millisecond-level closed-loop response quickly eliminates pressure deviation caused by process air intake fluctuation, chamber leakage and environmental disturbance without regulation delay or working condition oscillation. Algorithm: Exclusive optimized self-adaptive PID algorithm automatically adjusts parameters according to different process formulas, adapting to multi-process switching production scenarios.
2. Electrical & Signal Parameters
Operating Power Supply: Adapts to standard industrial power supply for semiconductor equipment with wide voltage range, resisting minor grid fluctuation and ripple interference for stable power supply. Signal Mode: Supports bidirectional transmission of standard industrial digital and analog signals, realizing process command reception, operating status feedback and pressure data upload. Isolation Performance: Full-circuit electrical isolation with independent sampling, control and communication loops, eliminating measurement abnormalities caused by signal crosstalk, static impact and radio frequency interference.
3. Process Adaptation Parameters
Process Compatibility: Supports storage and calling of multiple sets of standard semiconductor process parameters, adapting to etching, deposition, ion implantation and other precision vacuum processes. Control Modes: Supports constant pressure control, dynamic pressure following and step pressure regulation to meet segmented pressure control requirements of complex processes. Data Acquisition: High-frequency synchronous sampling records full-process pressure curves, regulation parameters and operating status, providing accurate data support for process review, parameter optimization and yield analysis.
4. Environmental Operating Parameters
Operating Temperature：18℃～28℃, maintaining stable measurement accuracy, regulation performance and logic functions under standard clean room constant temperature conditions.
Storage Temperature：-20℃～+60℃, no chip aging, parameter drift or board performance attenuation during long-term storage.
Operating Humidity：40%~60% RH, non-condensing, adapting to standard low-humidity and dust-free clean room conditions without circuit dampness, insulation degradation or signal abnormality.
Condition Adaptation: Passed semiconductor-grade EMC compatibility tests, resisting high-frequency equipment interference, static environment and constant temperature/humidity working conditions. The dust-proof and anti-corrosion design fully complies with precision semiconductor equipment operation specifications, supporting long-term stable sealed cabinet operation.
III. Key Features
1. Ultra-High Precision Vacuum Closed-Loop Control for Yield Improvement
Equipped with high-precision vacuum sampling and self-adaptive PID closed-loop regulation technology, AX7670-19 realizes microsecond-level vacuum sampling and millisecond-level dynamic correction. It accurately suppresses process pressure fluctuation, micro chamber leakage and air intake disturbance, maintaining stable steady-state operation without oscillation or overshoot. Its control accuracy fully meets the precision requirements of 8/12-inch wafer etching and thin film deposition processes, effectively avoiding wafer coating unevenness, etching offset and process defects to greatly improve semiconductor product yield and production stability.
2. Strong Multi-Process Adaptive Compatibility
Built with multiple sets of exclusive process control programs, the module supports free switching of various vacuum process modes, fully compatible with PVD, CVD, dry etching, ion implantation and other semiconductor vacuum processes. With self-adaptive parameter correction capability, it automatically optimizes regulation parameters according to equipment operating status, subtle environmental changes and formula differences, eliminating frequent manual calibration and adapting to flexible semiconductor production with multiple varieties and high precision.
3. Comprehensive Self-Diagnosis & Protection for Process Safety
Integrated with a complete independent monitoring and protection system, it real-timely self-inspects hidden faults such as vacuum pressure over-limit, gas circuit blockage/leakage, signal abnormality, power fluctuation and module over-temperature. Once abnormal conditions are detected, it immediately triggers precise protection, outputs alarm signals and locks process status to linkage equipment protection logic, effectively preventing process abnormality diffusion, equipment failure and batch wafer scrap risks to ensure full-process controllable manufacturing safety.
4. High-Precision Data Traceability for Process Optimization
The high-frequency data acquisition and storage function records full-process pressure curves, regulation parameters, equipment status and abnormal events with precise timestamps, enabling complete review of single-process working conditions. Data can be seamlessly connected with AMAT original process monitoring platforms and factory MES systems to support process parameter optimization, defect traceability, equipment condition analysis and production compliance filing, adapting to refined intelligent management of semiconductor manufacturing.
5. Standard Original Design for Convenient O&M and Replacement
Adopting strict AMAT original standard design, it features fully compatible hardware dimensions, interface definitions, communication protocols and control logic with original process equipment. It can directly replace old modules without program modification, gas circuit adjustment or logic revision. With stable operation, long calibration cycle and ultra-low failure rate, it greatly reduces equipment downtime and operation costs, suitable for new production line assembly, old equipment upgrading and fault replacement scenarios.
IV. Working Principle
The AMAT AX7670-19 vacuum pressure controller operates based on the high-precision pressure sampling + self-adaptive PID closed-loop dynamic regulation principle. It collects real-time process chamber vacuum pressure data and dynamically corrects gas circuit output by comparing with preset process parameters to achieve constant vacuum control. The overall workflow includes six core links: signal sampling, parameter operation, deviation correction, closed-loop regulation, condition monitoring and data storage.
During equipment operation, the built-in high-precision vacuum sensor collects real-time chamber vacuum pressure signals at high frequency, which are processed by isolation filtering, signal shaping and precision calibration before being transmitted to the core operation chip. The controller accurately compares the real-time pressure value with the preset standard process parameters and rapidly calculates the pressure deviation and deviation change rate.
Dynamic adjustment commands are output through the exclusive self-adaptive PID algorithm to precisely control the opening and air intake of the gas circuit regulation unit, correct chamber vacuum pressure in real time, and eliminate pressure deviation caused by process disturbance and working condition fluctuation. The module monitors power supply, signal transmission, gas circuit status and self-operation conditions throughout the process, triggers alarm and process locking immediately upon abnormality, and records full-process data to realize closed-loop control, safety protection and data traceability of precision vacuum processes.
V. Application Scenarios
1. Semiconductor Precision Vacuum Process Control: Applied to core processes such as dry etching, thin film deposition, PVD/CVD coating and ion implantation for 8-inch and 12-inch wafer production lines as the core vacuum pressure regulation unit.
2. AMAT Original Equipment Matching & Replacement: Dedicated to full-series AMAT vacuum process equipment for faulty module replacement, precision upgrading and aging component iteration.
3. High-End Precision Vacuum Process R&D and Mass Production: Adapts to laboratory process research, new formula commissioning and large-scale precision mass production to ensure process stability and parameter consistency.
4. Semiconductor Production Line Intelligent Management: Connects with factory MES and upper monitoring systems to realize real-time data upload, process condition monitoring, fault traceability and process optimization, supporting intelligent and refined production management.
5. Clean Room Precision Equipment Renovation & Upgrading: Used for technical transformation of old semiconductor process equipment to improve vacuum pressure control accuracy, optimize product yield and meet high-end semiconductor manufacturing standards.
