Description
ZYGO ZMI-7714
Full Model：ZMI-7714
Brand & Origin：ZYGO, USA (Sub-brand of Ametek Precision Optics Division)
Product Positioning
ZYGO ZMI-7714 is a high-precision fiber-coupled laser interferometry measurement system of ZMI series, serving as the core optical measuring unit for ultra-precise displacement, vibration, topography and angle detection. Based on homodyne He-Ne laser interference principle, it realizes non-contact nano-scale high-speed measurement. Specially designed for high-precision metrology scenarios such as semiconductor wafer processes, optical component inspection, precision machine tool calibration, MEMS microstructure testing and aerospace precision assembly. It undertakes core metrology tasks including real-time collection of micro-displacement, surface profile scanning, dynamic spindle error detection, micro-device deformation monitoring and non-destructive measurement of internal components in vacuum chambers. It is an essential original core metrology spare part for high-end precision laboratories, semiconductor production line metrology stations, supporting of ultra-precision processing equipment and replacement & upgrading of outdated laser measuring equipment.
Hardware ArchitectureThe integrated all-in-one unit integrates laser emitter, polarization beam splitting optical path, fiber coupling transmission module, interference signal acquisition circuit, high-speed photoelectric detector, DSP digital signal processing unit and multi-channel synchronous output interface. The entire optical path is hermetically sealed and dust-proof; the optical cavity adopts nitrogen moisture-proof isolation to eliminate water vapor interference, and the optical and circuit areas are independently shielded to remove electromagnetic clutter interference to weak interference signals. It features ultra-high measurement resolution, non-contact wear-free performance, fast dynamic response, vacuum environment adaptability and minimal long-term temperature drift. Deeply optimized for harsh working conditions such as clean workshops, vacuum chambers, high-frequency micro-vibration and ultra-low/high temperature constant-temperature laboratories, it effectively solves industrial pain points such as wear of contact sensors, measurement trailing, insufficient measurement precision below micron level and data deviation caused by high-temperature deformation.
Mounting SpecificationThe compact integrated main body supports three installation modes: desktop platform fixing, cabinet embedded installation and split layout with fiber drawn out outside vacuum chambers. Matching standard fiber measuring probes can be extended remotely into vacuum and narrow closed chambers for measurement. The front panel is equipped with status indicators and simple operation buttons, matched with upper computer data acquisition software to support on-site parameter configuration, real-time waveform observation and fault code reading. The whole machine meets Class100 cleanroom standard for semiconductor industry with no dust falling during disassembly and assembly, neat wiring, fully complying with ZYGO original factory specifications for installation, cleanliness control, operation and calibration of precision metrology equipment.
Compatible SystemsExclusively compatible with ZYGO MetroPro professional metrology analysis software, it can seamlessly connect with coordinate measuring machines, wafer inspection platforms, ultra-precision lathes/grinders, MEMS probe stations and vacuum coating equipment. Compatible with high-speed data transmission protocols including EtherCAT, USB3.0 and RS422, it supports synchronous timing collection of multiple ZMI-7714 units to build multi-dimensional synchronous metrology platforms. It outputs raw interference data, displacement waveforms and spectrum analysis files to realize automatic batch detection, long-term stability monitoring and equipment error compensation calibration, supporting full-process quality control of nano-precision manufacturing.
Product CharacteristicsAn original industrial-grade nano-scale laser interferometry measuring unit. It completes optical path calibration, long-term temperature drift aging, vacuum condition verification, full EMC electromagnetic compatibility and cleanliness testing before factory delivery. Equipped with stabilized single-frequency 1550nm He-Ne laser, it delivers sub-nanometer measurement resolution and supports dynamic high-speed sampling. The split fiber design separates the main unit from measuring probes, adapting to closed vacuum and narrow high-temperature chambers. Integrated full-dimensional self-check protections against optical path failure, laser power attenuation, fiber bending loss and temperature over-limit. It supports 24/7 uninterrupted continuous metrology. Outdated ZMI laser measuring modules of the same series can be replaced in situ without damage, adapting to precision upgrading of semiconductor and optical precision production lines and technical renovation of metrology systems.
II. Technical Specifications
1. Optical & Laser Parameters
Laser Type: Frequency-stabilized single-frequency He-Ne laser, wavelength 1550nm, active constant temperature control for optical power stabilization with power fluctuation ＜0.5%.
Measurement Principle: Homodyne interference detection without redundant Doppler frequency shift compensation, high signal-to-noise ratio.
Measuring Range: Standard ±120mm; extended long-distance measurement available via extended fiber.
Resolution: Sub-0.1nm displacement resolution, angle measurement resolution 0.001arcsec, meeting ultra-precise detection requirements for micro-deformation and micro-vibration.
Fiber Transmission: Standard 2m transmission fiber, optional 5m/10m extended fiber, bending-resistant and low signal loss, adapting to remote measurement in vacuum chambers.
2. Sampling & Dynamic Performance Parameters
Built-in high-speed DSP real-time signal processing unit with maximum sampling rate of 1.2MHz, capable of capturing high-frequency micro-vibration dynamic signals up to kHz level.
Dynamic Bandwidth: Full coverage 0–500kHz with no signal phase lag or amplitude attenuation.
Linearity: Full-range measurement linear error ＜±0.05nm without segmented measurement offset.
Supports continuous waveform collection, automatic peak/valley recording and real-time FFT spectrum operation, adapting to high-frequency deformation testing of spindle dynamic vibration and MEMS devices.
3. Electrical & Communication Parameters
Power Supply: DC 24V industrial wide-voltage DC power supply, power consumption ≤28W, low heat generation without optical path thermal drift.
Communication Interfaces: USB3.0 high-speed data port, EtherCAT real-time industrial bus and RS422 serial port; parallel output of three interfaces without resource preemption of sampling.
Digital Output: Differential TTL synchronous trigger signal, capable of time sequence synchronization with motion controllers and probe stations with multi-device synchronization error ＜1ns.
The circuit is equipped with multi-stage EMI filtering and electrostatic discharge loops to resist electromagnetic interference from inverters and servo motors in clean workshops.
4. Protection & Self-Diagnosis Parameters
Full-link real-time self-inspection system monitors laser output power, fiber transmission loss, photoelectric detector signal amplitude, unit ambient temperature and optical path sealing air pressure.
Fault self-locking mechanism: When laser attenuation exceeds standard, fiber breakage, unit over-temperature or signal loss occurs, the measuring output is automatically locked and fault codes are synchronously uploaded to upper software to avoid invalid metrology data interfering with detection results.
The whole machine adopts IP54 sealed dust-proof and moisture-proof design, and the optical cavity isolates water vapor and dust erosion, adapting to constant temperature & humidity laboratories and semiconductor clean workshops.
5. Environmental Operating Parameters
Operating Temperature：18℃～26℃ (standard metrology range), extended working range 0℃～40℃
Storage Temperature：-20℃～+60℃
Operating Humidity：20%~70% RH, non-condensing
Vacuum Adaptation: The probe side can work in high vacuum of 1×10⁻⁶Pa for a long time, and the main unit is placed under normal pressure externally.
The whole machine passes semiconductor cleanliness certification, CE and FCC optical equipment safety certifications. It withstands minor airflow disturbance, low-frequency equipment vibration and long-term uninterrupted sampling in clean workshops, widely used in semiconductor wafer inspection, optical lens metrology, ultra-precision machine tool calibration, MEMS micro-device testing and aerospace part geometric tolerance detection.
III. Key Features
1. Sub-Nanometer Ultra-High Resolution, Non-Contact Non-Destructive Measurement
Relying on homodyne frequency-stabilized laser interference optical path, it achieves ultimate displacement resolution of 0.1nm. The measuring probe has no physical contact with the measured workpiece, eliminating secondary interference such as indentation, wear and micro-deformation. It perfectly adapts to high-precision and fragile workpieces such as ultra-thin wafers, soft optical films and fragile MEMS microstructures. It can accurately capture nano-scale thermal deformation, assembly micro-gaps and spindle runout error below micron level, greatly improving detection precision and product yield of precision manufacturing.
2. Split Fiber Layout, Flexible Adaptation for Vacuum & Narrow Cavities
The main unit and measuring probe are separated via fiber. Only the miniature optical probe extends into vacuum chambers, sealed coating machines and narrow machining inner cavities, while the main unit is placed in atmospheric clean areas for convenient operation and calibration. Optional extended fiber adapts to synchronous multi-station detection of large vacuum equipment, solving the pain point that traditional integrated interferometers cannot measure inside sealed high-temperature/vacuum cavities and expanding application scenarios of precision metrology.
3. MHz High-Speed Synchronous Sampling for Full-Range Dynamic Vibration Capture
The maximum 1.2MHz high-speed sampling bandwidth covers high-frequency vibration signals from 0 to 500kHz. Matched with differential synchronous trigger interface, it can realize nanosecond-level time sequence synchronization with motion control systems, real-time collection of dynamic waveforms such as high-speed spindle rotation vibration of machine tools, high-frequency resonance of MEMS devices and high-speed tensile deformation of thin films, supporting real-time FFT spectrum analysis and providing complete dynamic data support for equipment error compensation and process parameter optimization.
4. Full Optical Path Constant Temperature Frequency Stabilization, Low Drift for Long-Term Measurement
The laser is equipped with active constant temperature control module, and the integrated optical cavity is sealed and heat-insulated to restrain wavelength drift and measurement zero offset caused by ambient temperature change. The full-range linear error is controlled within 0.05nm, and the zero drift of 72-hour continuous uninterrupted sampling is less than 0.3nm. No frequent shutdown recalibration is required, adapting to 24-hour automatic batch detection requirements of production lines and reducing man-hour for manual calibration.
5. Standard Software Compatibility, Convenient In-Situ Replacement & Maintenance
Hardware dimensions, fiber interfaces, communication protocols and data output formats fully comply with ZYGO ZMI series standards. Outdated ZMI measuring modules can be directly replaced by plugging in situ without rebuilding metrology programs or modifying upper computer software configurations. The supporting MetroPro software has built-in standardized analysis templates to output test reports and tolerance judgment data with one click, adapting to dual operation and maintenance requirements of laboratory metrology and production line automatic detection, greatly shortening downtime for equipment technical renovation.
ZYGO ZMI-7714 is a fiber-coupled single-frequency homodyne laser interference measurement system. After connecting standard DC24V power supply, the equipment automatically completes laser constant temperature preheating, optical path power self-inspection, fiber loss detection, communication link matching and zero reference calibration upon power-on, and enters continuous measurement sampling state after initialization.
The built-in frequency-stabilized He-Ne laser outputs constant wavelength polarized laser, which is divided into reference beam and measuring beam through beam splitting unit. The reference beam forms a fixed interference reference on the internal standard reference mirror of the main unit; the measuring beam is transmitted to the external measuring probe through transmission fiber, projected onto the surface of the measured workpiece and reflected back to the main unit optical path along the original route. The two beams interfere with each other, and the weak interference signal is converted into electrical signal by high-speed photoelectric detector and transmitted to DSP digital processing unit.
The DSP unit calculates the real-time displacement, deformation and vibration amplitude data of the measured workpiece in real time by solving the interference phase difference, and synchronously uploads raw waveforms and spectrum data to the upper MetroPro metrology software through multi-channels of USB/EtherCAT/RS422. During the whole measurement process, it continuously monitors laser power, fiber loss and unit temperature. If abnormalities such as optical path attenuation, fiber breakage and over-temperature are detected, the measuring output is immediately locked and fault alarms are uploaded. Under normal working conditions, it continuously compensates tiny measurement deviation caused by ambient temperature drift and airflow disturbance, and continuously outputs stable and high-precision metrology data, providing reliable numerical basis for calibration of ultra-precision manufacturing equipment and quality inspection of workpieces.
- Semiconductor Wafer Process Metrology: Used for flatness detection of silicon carbide/silicon wafers, deformation monitoring of thin film deposition, micro-displacement monitoring inside vacuum lithography chambers and micro-contact deformation measurement of probe stations, meeting nano-scale process control standards of semiconductor industry.
- Precision Inspection of Optical Components: Non-destructive measurement of surface profile and curvature error of optical lenses, free-form surface mirrors and diffraction gratings, replacing contact profilometers to avoid lens scratches.
- Calibration System of Ultra-Precision Machine Tools: Dynamic detection and compensation calibration of spindle runout, guide rail straightness and positioning error of ultra-precision grinders, diamond lathes and coordinate measuring machines.
- MEMS & Micro-Device Testing: Automatic testing of high-frequency vibration and deformation characteristics of micro-sensors, micro-cantilevers and resonant devices to obtain dynamic resonance spectrum parameters of devices.
- Technical Renovation of Precision Equipment & Spare Replacement for Metrology: Used for upgrading and replacing outdated laser interferometers on production lines, transformation of vacuum metrology systems and capacity expansion of laboratory precision metrology platforms, solving problems of outdated equipment such as insufficient resolution, large temperature drift and incompatibility with vacuum cavity measurement. It serves as an original core supporting equipment for nano-scale precision metrology.
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