Description
1. Overview
ADVANCED ENERGY 3153109-002 is a high-voltage power supply module for electrostatic chucks (ESC) specially developed for semiconductor process equipment. As core supporting power supply hardware for etching machines and thin film deposition equipment, it is widely deployed in precision semiconductor manufacturing processes including wafer etching, PVD and CVD.
This original dedicated high-voltage power unit supplies precise, stable and controllable high-voltage bias power to the electrostatic chuck inside the process chamber. It fulfills key functions such as wafer clamping & fixation, static charge release and process voltage stabilization, acting as a critical precision power component that guarantees process uniformity and wafer yield in semiconductor manufacturing.
Featuring high-precision high-voltage output, ultra-low ripple, fast voltage regulation response and intelligent fault self-check, this module is engineered for cleanroom, high-precision and heavy electromagnetic interference environments specific to semiconductor fabrication. It accurately matches the high-voltage threshold required for wafer clamping and eliminates process anomalies like wafer displacement, clamping failure and parameter deviation caused by voltage fluctuation.Equipped with multiple electrical protection mechanisms and closed-loop voltage regulation, it supports long-term continuous precision process operation. It is applicable to new equipment assembly, replacement of faulty power modules on legacy semiconductor tools and precision upgrade of process equipment, serving as an indispensable dedicated high-voltage power component for high-end semiconductor processing equipment.
2. Technical Features
2.1 High-Precision High-Voltage Output with Excellent Process Compatibility
Designed exclusively for powering semiconductor electrostatic chucks, it delivers high-accuracy high voltage with extremely low ripple and noise, enabling micro-level voltage regulation that fully satisfies stringent stability requirements for etching and deposition processes.The output voltage boasts superior linearity and can be precisely tuned to match clamping voltage demands for wafers of different processes and materials. It ensures flat and evenly stressed wafer clamping, prevents wafer shifting, warping and machining deviation during processing, and significantly improves process consistency and production yield of semiconductor fabrication.
2.2 Closed-Loop Intelligent Voltage Regulation with Rapid Dynamic Response
Built with high-speed voltage sampling and closed-loop feedback regulation circuits, it monitors output high voltage in real time and performs millisecond-level dynamic voltage adjustment to counteract load fluctuation, transient grid interference and chamber condition variation.Output voltage is locked constant throughout operation to eliminate voltage drift and fluctuation induced by load changes or equipment startup/shutdown, maintaining consistent clamping force of the electrostatic chuck and supporting non-stop batch production of process tools.
2.3 Multi-Layer Electrical Protection for Safe and Reliable Operation
It integrates comprehensive safety mechanisms including overvoltage protection for high-voltage output, overcurrent current limiting, short-circuit latching protection, reverse voltage prevention, surge suppression and electrostatic discharge protection.In case of common high-voltage hazards in semiconductor equipment such as electric leakage, abnormal load and circuit faults, the module activates latching protection instantly and cuts off high-voltage output. This prevents breakdown of chamber components, wafer damage and burnout of rear-end loads, while avoiding reverse impact on the equipment main control system, fully securing process equipment and production safety.
2.4 Industrial-Grade Precision Reinforcement for Cleanroom Process Conditions
Adopting a fully sealed modular precision structure with three-proof conformal coating on the circuit board for dustproofing, moisture resistance, corrosion resistance and vibration resistance, it fits the constant temperature & humidity, ultra-clean and low-dust operating environment of semiconductor cleanrooms.Military-grade precision electronic components are adopted with minimal temperature drift and time drift, ensuring no parameter deviation during long-term operation. Strong electromagnetic interference immunity enables stable performance against intense RF disturbance inside process chambers, supporting 24/7 non-stop precision manufacturing.
2.5 Built-In Fault Self-Diagnosis for Efficient Maintenance
The module is embedded with hardware self-test and fault diagnosis functions. It automatically completes circuit verification, high-voltage loop inspection and load status detection upon power-up. During runtime, it continuously monitors hidden risks including abnormal power input, high-voltage leakage, load failure and circuit malfunction, pinpoints faults precisely and latches the fault state.Fault codes are available for traceable troubleshooting, eliminating complicated calibration and commissioning and greatly reducing equipment downtime and maintenance costs for semiconductor fabs.
2.6 Native OEM Standardized Design with High Replacement Compatibility
Compliant with original process power supply design specifications of Advanced Energy, its pinout definition, output parameters and control logic are fully compatible with corresponding semiconductor equipment models with standardized universal mechanical layout.It can directly replace aged or faulty legacy power modules of the same part number without modifying equipment wiring, process parameters or control programs, realizing plug-and-play deployment to rapidly restore equipment process accuracy and operational stability for routine maintenance and system upgrade of semiconductor tools.
3. Specification Parameters
3.1 Basic Model Information
- Part Number: 3153109-002
- Manufacturer: ADVANCED ENERGY
- Device Type: Dedicated High-Voltage Power Supply Module for Semiconductor Electrostatic Chuck (ESC)
- Primary Application: High-voltage power supply for electrostatic wafer clamping on semiconductor etching and deposition equipment
- Core Functions: High-precision regulated high-voltage output, constant-force chuck clamping, closed-loop voltage adjustment, overload & short-circuit protection, fault self-diagnosis, process voltage stabilization
- Compatible Equipment: Wafer etchers, PVD deposition tools, CVD process equipment, semiconductor vacuum processing equipment
- Application Scenarios: Precision semiconductor manufacturing, wafer fixation & clamping, high-voltage power supply for process chambers, replacement and upgrade of power units on legacy equipment
3.2 Electrical Performance Parameters
- Input Voltage: Standard industrial DC power input, compliant with power supply specifications of semiconductor equipment racks
- Output Type: High-precision regulated DC high-voltage output matched to load characteristics of ESC electrostatic chucks
- Regulation Accuracy: Ultra-high linear voltage regulation with ultra-low ripple and noise to meet precision process voltage requirements
- Regulation Method: High-speed closed-loop feedback dynamic voltage regulation with adaptive load adjustment
- Response Speed: Millisecond-level dynamic response to rapidly suppress voltage fluctuation and transient interference
- Output Characteristics: Zero voltage drift, constant clamping force and superior process consistency over long-duration operation
3.3 Protection & Diagnosis Parameters
- Overvoltage Protection: Automatic shutdown and latching protection when output high voltage exceeds rated threshold
- Overcurrent Protection: Intelligent current limiting under load overload to prevent circuit burnout
- Short-Circuit Protection: Instant power cut and latching upon rear-end load short circuit; reset allowed only after fault clearance
- Surge Protection: Built-in surge absorption circuit to withstand transient voltage spikes from equipment cycling and RF interference
- Self-Diagnosis: Power-on self-test, real-time operational monitoring, fault state latching and fault traceability
3.4 Environmental Specifications
- Operating Temperature: -10 ℃ ~ +60 ℃, suitable for constant-temperature cleanroom environments
- Storage Temperature: -55 ℃ ~ +125 ℃
- Operating Humidity: 5% ~ 95% RH (non-condensing), adapted to dust-free clean environments
- Protection Structure: Fully sealed triple-proof coated construction with dust, moisture, aging and EMI resistance
- Environmental Adaptability: Tolerant to RF interference, chamber electromagnetic disturbance and minor equipment vibration in semiconductor processes
- Operation Mode: Supports 24-hour non-stop continuous precision process operation
3.5 Mechanical & Maintenance Parameters
- Mounting Method: Standard rack embedded installation compatible with cabinet layout of original semiconductor equipment
- Structural Features: Highly integrated modular design with no vulnerable mechanical parts and extremely low failure rate
- Status Monitoring: Equipment host system can read module running status, output condition and fault information in real time
- Compatibility: Factory-standardized parameters requiring no secondary calibration for direct drop-in replacement
- Maintenance Features: No routine calibration required; faults quickly located via built-in diagnostics to lower maintenance expenditure
4. Working Principle
Upon power-on, the ADVANCED ENERGY 3153109-002 high-voltage power module first executes full hardware self-inspection, input power detection and verification of output circuits and load conditions. It enters precision regulated power supply mode only after successful self-check.
Receiving control commands from the equipment main controller, the module converts standard input voltage into stable DC high voltage required by the electrostatic chuck via internal high-precision boost and regulation circuits.
During operation, high-speed closed-loop feedback sampling circuits continuously sample the actual output high voltage, compare it against preset process voltage values, and automatically adjust output amplitude within milliseconds to counteract voltage deviation caused by grid fluctuation, load variation and chamber electromagnetic interference.
Output high voltage is kept constant to deliver consistent and even clamping voltage to the electrostatic chuck, securing wafers flatly and stably and ensuring uniformity throughout etching, deposition and other fabrication steps.
The module monitors loop current, output voltage and load conditions in real time throughout operation. Once overvoltage, overcurrent, short circuit, leakage or load abnormality is detected, the latching protection mechanism triggers immediately to cut off high-voltage output, lock the fault status and upload fault messages. This prevents damage to chamber components, wafers and equipment hardware induced by abnormal high voltage.Automatic or manual reset restores normal operation after the root cause of the fault is eliminated, ensuring stability, safety and process precision of semiconductor precision manufacturing end-to-end from the power supply side.
5. Application Scenarios
5.1 Power Supply for Wafer Etching Processes in Semiconductor Fabrication
Serving as the core ESC chuck high-voltage power unit for wafer etching tools, it provides stable and accurate high voltage to chamber electrostatic chucks for precise wafer fixation. It eliminates wafer offset, vibration and detachment during processes, guarantees uniformity and dimensional accuracy of dry etching, and acts as essential power hardware for semiconductor etching workflows.
5.2 Supporting Power for PVD & CVD Thin Film Deposition Processes
Compatible with physical vapor deposition (PVD) and chemical vapor deposition (CVD) equipment, it supplies regulated high voltage to wafer clamping assemblies inside process chambers. Uniform wafer stress and fixed positioning during thin film deposition improve film thickness uniformity, process repeatability and product yield, ideal for high-end precision thin-film semiconductor manufacturing.
5.3 Maintenance & Drop-In Replacement for Legacy Semiconductor Equipment
It directly replaces aged, faulty or performance-degraded original high-voltage power modules of the same part number. No modification to equipment wiring, process recipes or control programs is needed to resolve common failures including unstable voltage output, abnormal chucking and process alarm codes. It enables low-cost hardware upgrade and restores the precision processing capability of production tools.
5.4 Supporting Unit for Semiconductor Precision Vacuum Process Equipment
Widely applicable to various semiconductor vacuum process tools, it delivers stable high-voltage output under heavy electromagnetic interference and ultra-precision process conditions to support mass continuous production, meeting long-cycle, high-duty and high-accuracy production demands of semiconductor manufacturing fabs.
